HENGHUI Technology Corporation Limited Class A(SZSE:301678)

{{price.price}} CNY

{{price.change}}%

：{{price.high}}	：2966168	：%	：
：{{price.low}}	：184792266	：%	：105
：{{price.open}}	：-4.83%	：%	：39
：{{price.close}}	：-1.79	：%	：15314780989

-11.39	-20.64	-25.83	24.6
24.6	24.6	24.6	24.6
6.35	3.55	3.64	2966168
10756185	37958062	符号详情：1天涨跌率 -4.83	-8.82
-12.6	-3	-6	-8
64	68	71	2783984.6
3087916.5	5340996.33	8200355.82	1.11
-1.79	-0.4	-0.11	1.11
0.54		61	61
39	39	39	79
105	105	105	105
0.78		185970155.2
50985551.9	287155389.58
0.13	0.78
835949013.63
			211932000
-18596590	-1002879578.26	1921247614.42
894146484.24	399230342.57	1034457595.36	399230342.57
1588279987.28	108663366.47	126410704.77	126410704.77
31578017.1	2066297849.57	14323565419.2	14.43

			22.25
	34.35		16.52
	21.27

HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It offers smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China.

： http://www.henghuiic.com

：Lin Zhu

：2017

：Zibo

：Producer manufacturing

：Metal fabrication